Invention Grant
- Patent Title: Resistance measuring structures of stacked devices
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Application No.: US17382149Application Date: 2021-07-21
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Publication No.: US11901363B2Publication Date: 2024-02-13
- Inventor: Byounghak Hong , Seunghyun Song , Myunggil Kang , Kang-Ill Seo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L23/535 ; H01L29/423 ; H01L29/786 ; H01L21/8238 ; H01L21/822 ; H01L27/06 ; H01L27/092 ; G01R27/02

Abstract:
Resistance measuring structures for a stacked integrated circuit device are provided. The resistance measuring structures may include a first Complementary Field Effect Transistor (CFET) stack, a second CFET stack, and a conductive connection. The first CFET may include a first upper transistor that includes a first upper drain region and a first lower transistor that is between the substrate and the first upper transistor and includes a first lower drain region. The second CFET may include a second upper transistor that includes a second upper drain region and a second lower transistor that is between the substrate and the second upper transistor and includes a second lower drain region. The conductive connection may electrically connect the first upper drain region and the second upper drain region.
Public/Granted literature
- US20220367521A1 RESISTANCE MEASURING STRUCTURES OF STACKED DEVICES Public/Granted day:2022-11-17
Information query
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