Invention Grant
- Patent Title: Device over photodetector pixel sensor
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Application No.: US17355503Application Date: 2021-06-23
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Publication No.: US11901388B2Publication Date: 2024-02-13
- Inventor: Jhy-Jyi Sze , Dun-Nian Yaung , Alexander Kalnitsky
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Eschweiler & Potashnik, LLC
- The original application number of the division: US16402633 2019.05.03
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L27/146 ; H04N25/75 ; H04N25/79 ; H04N25/621

Abstract:
Various embodiments of the present application are directed towards a semiconductor-on-insulator (SOI) DoP image sensor and a method for forming the SOI DoP image sensor. In some embodiments, a semiconductor substrate comprises a floating node and a collector region. A photodetector is in the semiconductor substrate and is defined in part by a collector region. A transfer transistor is over the semiconductor substrate. The collector region and the floating node respectively define source/drain regions of the transfer transistor. A semiconductor mesa is over and spaced from the semiconductor substrate. A readout transistor is on and partially defined by the semiconductor mesa. The semiconductor mesa is between the readout transistor and the semiconductor substrate. A via extends from the floating node to a gate electrode of the readout transistor.
Public/Granted literature
- US20210320139A1 DEVICE OVER PHOTODETECTOR PIXEL SENSOR Public/Granted day:2021-10-14
Information query
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