Invention Grant
- Patent Title: Image sensor and manufacturing method thereof
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Application No.: US17184965Application Date: 2021-02-25
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Publication No.: US11901393B2Publication Date: 2024-02-13
- Inventor: Jhy-Jyi Sze , Sin-Yi Jiang , Yi-Shin Chu , Yin-Kai Liao , Hsiang-Lin Chen , Kuan-Chieh Huang , Jung-I Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G01S7/481

Abstract:
The present disclosure provides a semiconductor structure, including a substrate including a first material, wherein the first material generates electrical signals from radiation within a first range of wavelengths, an image sensor element including a second material, wherein the second material generates electrical signals from radiation within a second range of wavelengths, the second range is different from first range, a transparent layer proximal to a light receiving surface of the image sensor element, wherein the transparent layer is transparent to radiation within the second range of wavelength, and an interconnect structure connected to a signal transmitting surface of the image sensor element.
Public/Granted literature
- US20220271080A1 IMAGE SENSOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-08-25
Information query
IPC分类: