Invention Grant
- Patent Title: LED chip having fan-out structure and manufacturing method of the same
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Application No.: US16849842Application Date: 2020-04-15
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Publication No.: US11901397B2Publication Date: 2024-02-13
- Inventor: Jong Min Jang , Chang Yeon Kim
- Applicant: SEOUL VIOSYS CO., LTD.
- Applicant Address: KR Ansan-si
- Assignee: SEOUL VIOSYS CO., LTD.
- Current Assignee: SEOUL VIOSYS CO., LTD.
- Current Assignee Address: KR Ansan-si
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/22 ; H01L33/38 ; H01L33/44 ; H01L33/00 ; H01L33/54 ; H01L33/62

Abstract:
A light emitting package including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, a plurality of connection electrodes electrically connected to at least one of the first, second, and third LED sub-units, the connection electrodes having side surfaces and covering a side surface of at least one of the first, second, and third LED sub-units, a first passivation layer surrounding at least the side surfaces of the connection electrodes, an insulating layer having first and second opposed surfaces, with the first surface facing the LED sub-units, and a first electrode disposed on the first surface of the insulating layer and connected to at least one of the connection electrodes.
Information query
IPC分类: