Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17065931Application Date: 2020-10-08
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Publication No.: US11901401B2Publication Date: 2024-02-13
- Inventor: Koichi Nishita , Masaki Takeuchi , Yutaka Takeshima , Kazuhiro Inoue
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: ArentFox Schiff LLP
- Priority: JP 20006116 2020.01.17
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/498 ; H01L23/00 ; H01L23/522 ; H01G4/38 ; H01L49/02

Abstract:
A semiconductor device that includes a semiconductor substrate; a first capacitance section on the semiconductor substrate, the first capacitance section including a first electrode layer, a first dielectric layer, and a second electrode layer; a second capacitance section on the semiconductor substrate, the second capacitance section including a third electrode layer, a second dielectric layer, and a fourth electrode layer; a first external electrode; a second external electrode; a first lead wire led out from the first capacitance section to the first external electrode and having an inductance L1; and a second lead wire led out from the second capacitance section to the second external electrode and having an inductance L2, wherein an electrostatic capacity C1 of the first capacitance section and an electrostatic capacity C2 of the second capacitance section are different, and L1/L2=0.8 to 1.2.
Public/Granted literature
- US20210226000A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-07-22
Information query
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