Invention Grant
- Patent Title: Facet-free epitaxial structures for semiconductor devices
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Application No.: US17461178Application Date: 2021-08-30
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Publication No.: US11901412B2Publication Date: 2024-02-13
- Inventor: Winne Victoria Wei-Ning Chen , Pang-Yen Tsai
- Applicant: Taiwan Semicondutor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L21/308 ; H01L21/8238 ; H01L29/66 ; H01L29/786 ; H01L27/092 ; H01L29/78

Abstract:
The present disclosure describes a semiconductor device having facet-free epitaxial structures with a substantially uniform thickness. The semiconductor device includes a fin structure on a substrate. The fin structure includes a fin bottom portion and a fin top portion. A top surface of the fin bottom portion is wider than a bottom surface of the fin top portion. The semiconductor device further includes a dielectric layer on the fin top portion, an amorphous layer on the dielectric layer, and an epitaxial layer. The epitaxial layer is on a top surface of the amorphous layer, sidewall surfaces of the amorphous layer, the dielectric layer, the fin top portion, and the top surface of the fin bottom portion.
Public/Granted literature
- US20230064593A1 FACET-FREE EPITAXIAL STRUCTURES FOR SEMICONDUCTOR DEVICES Public/Granted day:2023-03-02
Information query
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