Invention Grant
- Patent Title: Series connected stacked vertical transistors for high voltage applications
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Application No.: US17134632Application Date: 2020-12-28
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Publication No.: US11901449B2Publication Date: 2024-02-13
- Inventor: Alexander Reznicek , Bahman Hekmatshoartabari , Tak H. Ning
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Daniel Morris
- The original application number of the division: US16365084 2019.03.26
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/423 ; H01L27/088 ; H01L29/786 ; H01L29/66

Abstract:
A method of forming an electrical device that includes forming a multilayered fin composed of a first source/drain layer for a first transistor, a first channel layer for the first transistor, a common source/drain layer for the first transistor and a second transistor, a second channel layer for the second transistor and a second source/drain layer for the second transistor. A common spacer is formed on the common source/drain layer that separates a first opening to the first channel layer from a second opening to the second channel layer. Gate structures are then formed in the first and second openings.
Public/Granted literature
- US20210119045A1 SERIES CONNECTED STACKED VERTICAL TRANSISTORS FOR HIGH VOLTAGE APPLICATIONS Public/Granted day:2021-04-22
Information query
IPC分类: