Invention Grant
- Patent Title: Methods for fabricating thin film III-V compound solar cell
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Application No.: US17170133Application Date: 2021-02-08
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Publication No.: US11901476B2Publication Date: 2024-02-13
- Inventor: Noren Pan , Glen Hillier , Duy Phach Vu , Rao Tatavarti , Christopher Youtsey , David McCallum , Genevieve Martin
- Applicant: MICROLINK DEVICES, INC.
- Applicant Address: US IL Niles
- Assignee: MICROLINK DEVICES, INC.
- Current Assignee: MICROLINK DEVICES, INC.
- Current Assignee Address: US IL Niles
- Agency: McCarter & English, LLP
- Agent David R. Burns
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/0687

Abstract:
The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
Public/Granted literature
- US20210328093A1 METHODS FOR FABRICATING THIN FILM III-V COMPOUND SOLAR CELL Public/Granted day:2021-10-21
Information query
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