Infrared imaging device including drive and signal lines configured to electrically connect first and second substrates
Abstract:
An imaging device includes a first structure 20, and a second structure 40, in which the first structure 20 includes a first substrate 21, a temperature detection element which is formed on the first substrate 21 and detects a temperature on the basis of an infrared ray, a signal line 71, and a drive line 72, the second structure 40 includes a second substrate 41, and a drive circuit provided on the second substrate 41 and covered with a covering layer 43, the first substrate 21 and a second electrode 41 are stacked, the signal line 71 is electrically connected with the drive circuit via a signal line connection portion 100, the drive line is electrically connected with the drive circuit via a drive line connection portion, and the signal line connection portion 100 includes a first signal line connection portion 102 formed in the first structure 20 and a second signal line connection portion 106 formed in the second structure 40.
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