Invention Grant
- Patent Title: Infrared imaging device including drive and signal lines configured to electrically connect first and second substrates
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Application No.: US16640151Application Date: 2018-08-10
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Publication No.: US11902696B2Publication Date: 2024-02-13
- Inventor: Hajime Hosaka , Kenichi Okumura , Yoshikazu Nitta
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: CHIP LAW GROUP
- Priority: JP 17193572 2017.10.03
- International Application: PCT/JP2018/030065 2018.08.10
- International Announcement: WO2019/069559A 2019.04.11
- Date entered country: 2020-02-19
- Main IPC: H04N5/33
- IPC: H04N5/33 ; G01J5/14 ; G01K7/01 ; G06V40/13 ; H04N23/62 ; G01J5/00

Abstract:
An imaging device includes a first structure 20, and a second structure 40, in which the first structure 20 includes a first substrate 21, a temperature detection element which is formed on the first substrate 21 and detects a temperature on the basis of an infrared ray, a signal line 71, and a drive line 72, the second structure 40 includes a second substrate 41, and a drive circuit provided on the second substrate 41 and covered with a covering layer 43, the first substrate 21 and a second electrode 41 are stacked, the signal line 71 is electrically connected with the drive circuit via a signal line connection portion 100, the drive line is electrically connected with the drive circuit via a drive line connection portion, and the signal line connection portion 100 includes a first signal line connection portion 102 formed in the first structure 20 and a second signal line connection portion 106 formed in the second structure 40.
Public/Granted literature
- US20210160439A1 IMAGING DEVICE Public/Granted day:2021-05-27
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