Invention Grant
- Patent Title: High-sensitivity piezoelectric microphone
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Application No.: US17681871Application Date: 2022-02-28
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Publication No.: US11902740B2Publication Date: 2024-02-13
- Inventor: Chengliang Sun , Bohao Hu , Binghui Lin , Zhipeng Wu , Wei Zhu , Lei Wang , Yu Zhou
- Applicant: WUHAN MEMSONICS TECHNOLOGIES CO., LTD.
- Applicant Address: CN Wuhan
- Assignee: Wuhan MEMSonics Technologies Co., Ltd.
- Current Assignee: Wuhan MEMSonics Technologies Co., Ltd.
- Current Assignee Address: CN Wuhan
- Agent Gang Yu
- Priority: CN 1910799686.8 2019.08.28 CN 1911299953.1 2019.12.17
- Main IPC: H04R17/02
- IPC: H04R17/02 ; H04R1/28 ; H04R1/40 ; H04R3/00

Abstract:
A piezoelectric microphone, includes: a wafer substrate including a cavity; a plurality of cantilever beams with a piezoelectric deck structure; a fixed column; a plurality of flexible elastic members; and a connecting section. The plurality of cantilever beams each includes a fixed end and a free end suspended above the cavity. The plurality of cantilever beams is of a structure in which one end is narrow and the other end is wide, and the fixed end is relatively narrow. The fixed column is disposed at the center of the bottom surface of the cavity. The fixed ends of the plurality of cantilever beams are all connected to the top surface of the fixed column. A gap is provided between every two adjacent cantilever beams. The plurality of flexible elastic members is connected to free ends of two adjacent cantilever beams to enable the cantilever beams to vibrate synchronously.
Public/Granted literature
- US20220182767A1 HIGH-SENSITIVITY PIEZOELECTRIC MICROPHONE Public/Granted day:2022-06-09
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