Invention Grant
- Patent Title: Compound semiconductor device
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Application No.: US17508933Application Date: 2021-10-22
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Publication No.: US11916140B2Publication Date: 2024-02-27
- Inventor: Sungjae Chang , Hokyun Ahn , Hyunwook Jung
- Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR 20210015161 2021.02.03 KR 20210074293 2021.06.08
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/78

Abstract:
Provided is a compound semiconductor device. The compound semiconductor device according to embodiments of the inventive concept includes a first semiconductor layer having a fin extending in a first direction on a substrate, an upper gate electrode extending in a second direction perpendicular to the first direction on the first semiconductor layer, a second semiconductor layer disposed between a sidewall of the fin and the upper gate electrode, a dielectric layer disposed between a top surface of the fin and the upper gate electrode, and a lower gate structure connected to a bottom surface of the first semiconductor layer by passing through the substrate.
Public/Granted literature
- US20220246751A1 COMPOUND SEMICONDUCTOR DEVICE Public/Granted day:2022-08-04
Information query
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