A method for interconnecting components of an electronic system includes depositing a sintering solution onto a first component to form an interconnection layer, the sintering solution having metal nanoparticles dispersed in a solvent, and a stabilizing agent adsorbed onto the nanoparticles. The nanoparticles have for more than 95.0% of their mass a metal selected from silver, gold, copper and alloys thereof and have a polyhedral shape with an aspect ratio of more than 0.8. The method also includes eliminating, at least partially, solvent from the layer to form an agglomerate in which the stabilizing agent binds nanoparticles together and maintains at least a portion of the nanoparticles at a distance from each other; debinding and sintering the layer by bringing the agglomerate into contact with a destabilizing agent to aggregate and coalesce the nanoparticles and depositing a second component in contact with the layer before or during debinding or sintering.