- Patent Title: Bamboo chip integrated material and manufacturing method thereof
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Application No.: US17043696Application Date: 2019-04-18
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Publication No.: US11919192B2Publication Date: 2024-03-05
- Inventor: Zhiping Wu , Jinbo Hu , Yanhui Xiong , Zhicheng Xue , Ting Li , Zhibin Hu , Yuankun Hu
- Applicant: HUNAN TAOHUAJIANG BAMBOO SCIENCE & TECHNOLOGY CO., LTD.
- Applicant Address: CN Hunan
- Assignee: HUNAN TAOHUAJIANG BAMBOO SCIENCE & TECHNOLOGY CO., LTD.
- Current Assignee: HUNAN TAOHUAJIANG BAMBOO SCIENCE & TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Hunan
- Agency: JCIP GLOBAL INC.
- Priority: CN 1910195046.6 2019.03.14
- International Application: PCT/CN2019/083252 2019.04.18
- International Announcement: WO2020/181614A 2020.09.17
- Date entered country: 2020-09-30
- Main IPC: B27D1/04
- IPC: B27D1/04 ; B27D1/10 ; B27N3/02 ; B27N3/20 ; B62D25/20 ; B62D29/02 ; B32B37/12

Abstract:
The invention discloses a bamboo chip integrated material. The bamboo chip integrated material is formed by a plurality of lengthened bamboo chips which are glued and overlaid; each lengthened bamboo chip is formed by a plurality of bamboo chip units which sequentially and continuously mesh and are butted; sharp teeth and grooves are formed in the two ends in the length direction of the bamboo chip units, wherein the sharp tooth of each bamboo chip unit and the groove of the corresponding bamboo sheet unit are matched to form a meshing butt-joint part, and the meshing butt-joint parts of the adjacent lengthened bamboo chips are arranged in a staggered mode; and each bamboo chip unit has a thickness of 4-12 mm and a width of 15-50 mm.
Public/Granted literature
- US20210060815A1 BAMBOO CHIP INTEGRATED MATERIAL AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-03-04
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