Invention Grant
- Patent Title: Method of manufacturing liquid jet head chip, liquid jet head chip, liquid jet head, and liquid jet recording device
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Application No.: US17542845Application Date: 2021-12-06
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Publication No.: US11919306B2Publication Date: 2024-03-05
- Inventor: Hitoshi Nakayama
- Applicant: SII Printek Inc.
- Applicant Address: JP Chiba
- Assignee: SII PRINTEK INC.
- Current Assignee: SII PRINTEK INC.
- Current Assignee Address: JP Chiba
- Agency: Crowell & Moring LLP
- Priority: JP 20202681 2020.12.07
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
The trouble of removing a protective film such as a poly-paraxylene film from the part not requiring the protective film is reduced. A method of manufacturing a head chip according to an aspect of the present disclosure includes a substrate preparation step of preparing an actuator plate substrate having a jet channel communicated with a nozzle hole configured to jet ink, and a non-jet channel which does not jet the ink, and a protective film formation step of forming a protective film configured to protect a common electrode formed on an inner surface of the jet channel from the ink in a state in which the jet channel is exposed and the non-jet channel is covered after the substrate preparation step.
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