Invention Grant
- Patent Title: Composite materials for dielectric applications
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Application No.: US17731690Application Date: 2022-04-28
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Publication No.: US11920023B2Publication Date: 2024-03-05
- Inventor: Colin Hayes , Colin Calabrese , Christine Hatter
- Applicant: Rohm and Haas Electronic Materials LLC
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC.
- Current Assignee: Rohm and Haas Electronic Materials LLC.
- Current Assignee Address: US MA Marlborough
- Main IPC: C08F212/32
- IPC: C08F212/32 ; C08F212/12 ; C08F226/06 ; C08F228/06 ; C08L25/02 ; C08L43/04
Abstract:
There is provided a dielectric composite material comprising (a) 20-50 weight % total solids of at least one thermosetting resin and other resin components; and (b) 50-70 weight % total solids of at least one inorganic particulate filler; where the at least one inorganic particulate filler is surface modified with one or more acrylic-based silane coupling agents.
Public/Granted literature
- US20230348706A1 COMPOSITE MATERIALS FOR DIELECTRIC APPLICATIONS Public/Granted day:2023-11-02
Information query
IPC分类:
