Invention Grant
- Patent Title: Wearable electronic device having heat dissipation structure
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Application No.: US17980721Application Date: 2022-11-04
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Publication No.: US11921553B2Publication Date: 2024-03-05
- Inventor: Jungkeun Lee , Chunsik Choi , Yonghee Jeung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Cha & Reiter, LLC
- Priority: KR 20200087992 2020.07.16
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G02B27/01 ; G06F1/16

Abstract:
According to an embodiment disclosed in the present document, an electronic device may include: a lens frame at least partially including a thermally conductive material; a pair of wearable members which can be rotatably coupled to the lens frame; at least one lens disposed in the lens frame; and transparent conductive lines disposed on the lens. The transparent conductive lines may be connected to the thermally conductive material of the lens frame to receive heat transferred from the lens frame. Other various embodiments are possible.
Public/Granted literature
- US20230059234A1 WEARABLE ELECTRONIC DEVICE HAVING HEAT DISSIPATION STRUCTURE Public/Granted day:2023-02-23
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