Invention Grant
- Patent Title: Multilayer capacitor having improved reliability by adjusting grain size of dielectric layer
-
Application No.: US17465176Application Date: 2021-09-02
-
Publication No.: US11923145B2Publication Date: 2024-03-05
- Inventor: Je Hee Lee , Seung In Baik , Ji Su Hong , Eun Ha Jang , Hyoung Uk Kim , Jae Sung Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20200144401 2020.11.02
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/012 ; H01G4/30

Abstract:
A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked in a first direction and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes formed outside the body and connected to the internal electrodes. The body includes an active portion and a side margin portion covering the active portion and opposing each other in a second direction, and 1
Public/Granted literature
- US20220139625A1 MULTILAYER CAPACITOR Public/Granted day:2022-05-05
Information query