An interconnect structure is provided. The interconnect structure includes first conducting lines and second conducting lines. The first conducting lines are formed of a first metallic material and include at least one individual first conducting line in contact with a first corresponding substrate conducting line. The second conducting lines are formed of a second metallic material and include at least one individual second conducting line between neighboring first conducting lines and in contact with a second corresponding substrate conducting line. The at least one individual second conducting line is separated from each of the neighboring first conducting lines by controlled distances.