Invention Grant
- Patent Title: Anisotropic conductive film and connected structure
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Application No.: US17472883Application Date: 2021-09-13
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Publication No.: US11923335B2Publication Date: 2024-03-05
- Inventor: Seiichiro Shinohara
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 13239180 2013.11.19 JP 14193168 2014.09.22 JP 14219793 2014.10.28
- The original application number of the division: US16003310 2018.06.08
- Main IPC: H01L23/00
- IPC: H01L23/00 ; C08K3/08 ; C09J7/20 ; C09J9/02 ; H05K3/32

Abstract:
Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35°. These anisotropic conductive films have stable connection reliability in COG connection.
Public/Granted literature
- US20220020724A1 ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE Public/Granted day:2022-01-20
Information query
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