Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US17876082Application Date: 2022-07-28
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Publication No.: US11923358B2Publication Date: 2024-03-05
- Inventor: Chung-Pin Huang , Hou-Yu Chen , Chuan-Li Chen , Chih-Kuan Yu , Yao-Ling Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- The original application number of the division: US15629904 2017.06.22
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/265 ; H01L21/8234 ; H01L29/66 ; H01L29/78

Abstract:
A device comprises a first transistor, a second transistor, a first contact, and a second contact. The first transistor comprises a first gate structure, first source/drain regions on opposite sides of the first gate structure, and first gate spacers spacing the first gate structure apart from the first source/drain regions. The second transistor comprises a second gate structure, second source/drain regions on opposite sides of the second gate structure, and second gate spacers spacing the second gate structure apart from the second source/drain regions. The first contact forms a first contact interface with one of the first source/drain regions. The second contact forms a second contact interface with one of the second source/drain regions. An area ratio of the first contact interface to top surface the first source/drain region is greater than an area ratio of the second contact interface to top surface of the second source/drain region.
Public/Granted literature
- US20220375931A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-11-24
Information query
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