Invention Grant
- Patent Title: Semiconductor device having buried gate structure and method for fabricating the same
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Application No.: US17829581Application Date: 2022-06-01
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Publication No.: US11923416B2Publication Date: 2024-03-05
- Inventor: Seong-Wan Ryu
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T GROUP LLP
- Priority: KR 20180021240 2018.02.22
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/324 ; H01L29/08 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor device includes: a substrate; a first source/drain region and a second source/drain region spaced apart from each other by a trench in the substrate; and a gate structure in the trench, wherein the gate structure includes: a gate dielectric layer formed on a bottom and sidewalls of the trench; a first gate electrode positioned in a bottom portion of the trench over the gate dielectric layer; a second gate electrode positioned over the first gate electrode; and a dipole inducing layer formed between the first gate electrode and the second gate electrode and between sidewalls of the second gate electrode and the gate dielectric layer.
Public/Granted literature
- US20220293734A1 SEMICONDUCTOR DEVICE HAVING BURIED GATE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2022-09-15
Information query
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