Invention Grant
- Patent Title: Butt joint flex circuit board interconnection
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Application No.: US17476755Application Date: 2021-09-16
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Publication No.: US11923628B2Publication Date: 2024-03-05
- Inventor: John Martinis , Bob Benjamin Buckley , Xiaojun Trent Huang
- Applicant: Google LLC
- Applicant Address: US CA Mountain View
- Assignee: GOOGLE LLC
- Current Assignee: GOOGLE LLC
- Current Assignee Address: US CA Mountain View
- Agency: Dority & Manning, P.A.
- Main IPC: H01R12/61
- IPC: H01R12/61 ; G06N10/40 ; G06N10/80 ; H01R43/02 ; H05K1/02 ; H05K1/03 ; H05K1/09 ; H05K1/14 ; H05K3/36 ; H10N60/80

Abstract:
Interconnections for connecting flex circuit boards in classical and/or quantum computing systems can include a first flex circuit board having a removed portion that exposes one or more signal lines and a second flex circuit board having a removed portion that exposes one or more other signal lines. The flex circuit boards can be aligned at the removed portions to form a signal trace gap near the exposed signal lines. Exposed signal lines of the first flex circuit board can be coupled with exposed signal lines of the second flex circuit board. A ground support layer can be coupled to the first flex circuit board and the second flex circuit board along the same side. An isolation plate at least partially covering the signal trace gap can be coupled to the first flex circuit board and/or the second flex circuit board on a side opposite of the ground support layer.
Public/Granted literature
- US20220085527A1 Butt Joint Flex Circuit Board Interconnection Public/Granted day:2022-03-17
Information query
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