Invention Grant
- Patent Title: Bootstrapped switch
-
Application No.: US17828516Application Date: 2022-05-31
-
Publication No.: US11923831B2Publication Date: 2024-03-05
- Inventor: Shih-Hsiung Huang
- Applicant: REALTEK SEMICONDUCTOR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C
- Priority: TW 0135350 2021.09.23
- Main IPC: H03K17/06
- IPC: H03K17/06 ; H03K17/0412 ; H03K19/017

Abstract:
A bootstrapped switch includes a first transistor, a second transistor, a first capacitor, three switches, and a switch circuit. The switch circuit includes a first switch, a second switch, a second capacitor, and a resistor. The first transistor receives the input voltage and outputs the output voltage. The first terminal of the second transistor receives the input voltage, and the second terminal of the second transistor is coupled to the first terminal of the first capacitor. The control terminal of the first switch receives a clock. The second switch is coupled between the control terminal of the first transistor and the first switch. The second capacitor is coupled between the control terminal of the first switch and the control terminal of the second switch. The resistor is coupled between the control terminal of the second switch and a reference voltage.
Public/Granted literature
- US20230091800A1 Bootstrapped switch Public/Granted day:2023-03-23
Information query