Invention Grant
- Patent Title: Imaging element and electronic device
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Application No.: US17250184Application Date: 2019-05-14
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Publication No.: US11924403B2Publication Date: 2024-03-05
- Inventor: Yoshiaki Inada
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: CHIP LAW GROUP
- Priority: JP 18115933 2018.06.19
- International Application: PCT/JP2019/019101 2019.05.14
- International Announcement: WO2019/244514A 2019.12.26
- Date entered country: 2020-12-10
- Main IPC: H04N17/00
- IPC: H04N17/00 ; H01L27/146 ; H04N25/76 ; H04N25/79

Abstract:
An imaging element of the present disclosure includes a first substrate on which a pixel circuit connected to a light receiving part is formed and a second substrate on which a pixel control part that controls the pixel circuit is formed, the first substrate and the second substrate being stacked. Then, the first substrate includes a first wiring formed corresponding to a first pixel row or pixel column, a second wiring formed corresponding to a second pixel row or pixel column, a first connection part that connects the first wiring and the pixel control part, a second connection part that connects the second wiring and the pixel control part, a switch part that controls connection between the first wiring and the second wiring, a first electrode connected to the first wiring via the switch part, and a second electrode connected to the second wiring via the switch part.
Public/Granted literature
- US20210176458A1 IMAGING ELEMENT AND ELECTRONIC DEVICE Public/Granted day:2021-06-10
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