Invention Grant
- Patent Title: Speaker adapter, and dual core speaker assembly
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Application No.: US17615221Application Date: 2019-05-31
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Publication No.: US11924604B2Publication Date: 2024-03-05
- Inventor: Bo Sun , Jian Wang , Cathy Chen , Na Liu
- Applicant: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
- Applicant Address: US CT Stamford
- Assignee: Harman International Industries, Incorporated
- Current Assignee: Harman International Industries, Incorporated
- Current Assignee Address: US CT Stamford
- Agency: Brooks Kushman P.C.
- International Application: PCT/CN2019/089537 2019.05.31
- International Announcement: WO2020/237627A 2020.12.03
- Date entered country: 2021-11-30
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04R1/28
Abstract:
The present disclosure provides a speaker adapter, and a dual core speaker assembly. The speaker adapter includes: a main body, symmetrically provided with two mounting portions at both sides for matching with speakers respectively; a bottom base, extending from and around the main body, for supporting the main body; and an inner cavity formed within the main body.
Public/Granted literature
- US20220232315A1 SPEAKER ADAPTER, AND DUAL CORE SPEAKER ASSEMBLY Public/Granted day:2022-07-21
Information query
