- Patent Title: Flexible printed circuit copper overlay for temperature management
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Application No.: US18195375Application Date: 2023-05-10
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Publication No.: US11924958B2Publication Date: 2024-03-05
- Inventor: Teruhiro Nakamiya , Kazuhiro Nagaoka , Satoshi Nakamura , Nobuyuki Okunaga
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agent John D. Henkhaus
- Main IPC: G11B5/48
- IPC: G11B5/48 ; H05K1/02 ; H05K1/11 ; H05K3/10

Abstract:
A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a first wiring layer including a first electrically conductive trace layout, a second wiring layer including a second electrically conductive trace layout, and a base film interposed between the first and second wiring layers, where the first conductive trace layout includes at least one thermally conductive protective island overlaying a respective portion of the second trace layout to provide a protective thermal barrier to the base film. Hence, maximum temperatures across various layers of the FPC laminate can be reduced, damage to the FPC prevented, and manufacturing yields improved.
Public/Granted literature
- US20230276566A1 FLEXIBLE PRINTED CIRCUIT COPPER OVERLAY FOR TEMPERATURE MANAGEMENT Public/Granted day:2023-08-31
Information query
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