Invention Grant
- Patent Title: Circuit board and method for manufacturing circuit board
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Application No.: US16767951Application Date: 2018-11-08
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Publication No.: US11924960B2Publication Date: 2024-03-05
- Inventor: Akira Haraguchi
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Yokkaichi
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Yokkaichi; JP Yokkaichi; JP Osaka
- Agency: Honigman LLP
- Priority: JP 17228223 2017.11.28
- International Application: PCT/JP2018/041506 2018.11.08
- International Announcement: WO2019/107106A 2019.06.06
- Date entered country: 2020-12-03
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/367 ; H05K1/18 ; H05K3/00 ; H05K7/20
Abstract:
Provided is a circuit board on which a circuit component is mounted on one side, and a recess is formed at a position corresponding to the circuit component on the other side, and the circuit board includes a first heat conductive member that is provided inside the recess and conducts heat generated by the circuit component.
Public/Granted literature
- US20230247754A1 CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD Public/Granted day:2023-08-03
Information query
