Invention Grant
- Patent Title: Heating or cooling apparatus-integrated heat sink for a computing device
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Application No.: US17576700Application Date: 2022-01-14
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Publication No.: US11925003B2Publication Date: 2024-03-05
- Inventor: Eric Michael Tunks , Joseph Andrew Vivio , Tyler Baxter Duncan
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Chamberlain, Hrdlicka, White, Williams, & Aughtry
- Agent Aly Z. Dossa
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H01L23/38 ; H05K1/02
Abstract:
A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.
Public/Granted literature
- US20230232590A1 HEATING OR COOLING APPARATUS-INTEGRATED HEAT SINK FOR A COMPUTING DEVICE Public/Granted day:2023-07-20
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