Systems, methods, and apparatuses for conducting heat from an ultrasound transducer and reducing drop impact forces are disclosed. A thermal management system including a thermally conductive compliant component in an ultrasound probe is disclosed. The thermal management system may include thermally conductive compliant component coupled to a transducer assembly. A printed circuit assembly (PCA) may be coupled to the compliant component. The thermally compliant component may conduct heat from the transducer assembly to the PCA. The PCA may be further coupled to a cable that may conduct heat from the PCA and away from the ultrasound probe.