Invention Grant
- Patent Title: Circuit board, method for producing circuit board, and imaging apparatus
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Application No.: US17289107Application Date: 2019-11-19
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Publication No.: US11929569B2Publication Date: 2024-03-12
- Inventor: Takayoshi Shimizu
- Applicant: RICOH COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: RICOH COMPANY, LTD.
- Current Assignee: RICOH COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP 18225441 2018.11.30
- International Application: PCT/JP2019/045272 2019.11.19
- International Announcement: WO2020/110828A 2020.06.04
- Date entered country: 2021-04-27
- Main IPC: H01R12/79
- IPC: H01R12/79 ; H01R12/77 ; H05K1/11 ; H05K3/00

Abstract:
A circuit board includes a board body and pair of connection portions disposed at both ends of the board body. Each of the pair of connection portions is inserted into a connector. Each of the pair of connection portions includes a connection terminal electrically connected to the connector, and at least one of the pair of connection portions includes an extending portion extending from the connection terminal to an insertion leading end of the at least one of the pair of connection portion. The extending portion is disposed at a position to avoid a virtual line extending in an insertion direction through a position where the connector and the connection terminal are electrically connected.
Public/Granted literature
- US20210328373A1 CIRCUIT BOARD, METHOD FOR PRODUCING CIRCUIT BOARD, AND IMAGING APPARATUS Public/Granted day:2021-10-21
Information query
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