Invention Grant
- Patent Title: Materials for printed circuit boards
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Application No.: US18096062Application Date: 2023-01-12
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Publication No.: US11930596B2Publication Date: 2024-03-12
- Inventor: Tarun Amla , Stefan J. Pastine
- Applicant: Thintronics, Inc.
- Applicant Address: US CA Berkeley
- Assignee: Thintronics, Inc.
- Current Assignee: Thintronics, Inc.
- Current Assignee Address: US CA Berkeley
- Agency: Element IP, PLC
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/11
Abstract:
Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.
Public/Granted literature
- US20230309221A1 MATERIALS FOR PRINTED CIRCUIT BOARDS Public/Granted day:2023-09-28
Information query
