Invention Grant
- Patent Title: Water-absorbing resin particles
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Application No.: US17040465Application Date: 2019-03-27
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Publication No.: US11931718B2Publication Date: 2024-03-19
- Inventor: Takashi Ito , Miki Sakoda , Mutsumi Matsuoka
- Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.
- Applicant Address: JP Hyogo
- Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.
- Current Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.
- Current Assignee Address: JP Hyogo
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP 18062075 2018.03.28
- International Application: PCT/JP2019/013397 2019.03.27
- International Announcement: WO2019/189485A 2019.10.03
- Date entered country: 2020-09-22
- Main IPC: B01J20/26
- IPC: B01J20/26 ; A61F13/15 ; B01J20/28 ; G01N11/00 ; C08F20/06

Abstract:
Water-absorbing resin particles have a repulsion rate of 5% or more according to the formula (h3−h2)/h1×100(%) when a cylinder with an inner diameter of 25.4 mm, which has a mesh-like bottom onto which 0.2 g of the water-absorbing resin particles are sprinkled, is placed in a container having ion exchange water in an amount of 30 times a mass of the water-absorbing resin particles, where h1 represents a free swelling height (mm) of the water-absorbing resin particles after 1 minute from initiation of water absorption, h2 represents a height (mm) of the water-absorbing resin particles after a load of 1.3×103 Pa is applied to the water-absorbing resin particles for 1 minute after 1 minute from initiation of the water absorption, and h3 represents a height (mm) of the water-absorbing resin particles after 1 minute from release of the load applied when measuring h2.
Public/Granted literature
- US20210023530A1 WATER-ABSORBING RESIN PARTICLES Public/Granted day:2021-01-28
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