Invention Grant
- Patent Title: Epoxy adhesive composition
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Application No.: US17040761Application Date: 2019-03-11
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Publication No.: US11932785B2Publication Date: 2024-03-19
- Inventor: Tasuku Yamada , Shiori Tateno , Yousuke Chiba , Takayuki Maeda , Yukio Ochitani , Hideaki Tanaka
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: WENDEROTH, LIND & PONACK, L.L.P.
- Priority: JP 18062503 2018.03.28
- International Application: PCT/JP2019/009732 2019.03.11
- International Announcement: WO2019/188202A 2019.10.03
- Date entered country: 2020-09-23
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C09J11/04

Abstract:
The present invention provides an epoxy adhesive composition capable of reducing re-aggregation of an adhesive layer modifier, maintaining favorable viscosity for a long period of time, exhibiting high adhesiveness, and reducing process failures during application of the adhesive. Provided is an epoxy adhesive composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; an adhesive layer modifier; and an epoxy resin, the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0, the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5.
Public/Granted literature
- US20210002528A1 EPOXY ADHESIVE COMPOSITION Public/Granted day:2021-01-07
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