Invention Grant
- Patent Title: Method for structurally joining substrates having different coefficients of linear thermal expansion
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Application No.: US16955955Application Date: 2018-12-18
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Publication No.: US11932786B2Publication Date: 2024-03-19
- Inventor: Urs Rheinegger , Elyes Jendoubi , Dominique Gallo , Christian Krüger
- Applicant: SIKA TECHNOLOGY AG
- Applicant Address: CH Baar
- Assignee: SIKA TECHNOLOGY AG
- Current Assignee: SIKA TECHNOLOGY AG
- Current Assignee Address: CH Baar
- Agency: Oliff PLC
- Priority: EP 208668 2017.12.19
- International Application: PCT/EP2018/085495 2018.12.18
- International Announcement: WO2019/121682A 2019.06.27
- Date entered country: 2020-06-19
- Main IPC: C09J163/04
- IPC: C09J163/04 ; C08G59/40 ; C09J175/14 ; C08G71/04
Abstract:
A method of bonding substrates having different coefficients of thermal expansion, especially in the shell construction of modes of transport or white goods, using a one-component thermosetting epoxy resin composition containing toughness improvers based on terminally blocked polyurethane prepolymers.
Public/Granted literature
- US20200325368A1 METHOD FOR STRUCTURALLY JOINING SUBSTRATES HAVING DIFFERENT COEFFICIENTS OF LINEAR THERMAL EXPANSION Public/Granted day:2020-10-15
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