Invention Grant
- Patent Title: Sensor arrangement
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Application No.: US17297909Application Date: 2019-11-27
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Publication No.: US11933441B2Publication Date: 2024-03-19
- Inventor: Veenith Shetty , Hans-Henning Hansen , Jens Jensen
- Applicant: Danfoss A/S
- Applicant Address: DK Nordborg
- Assignee: Danfoss A/S
- Current Assignee: Danfoss A/S
- Current Assignee Address: DK Nordborg
- Agency: McCormick, Paulding & Huber PLLC
- Priority: DE 2018130917.1 2018.12.05
- International Application: PCT/EP2019/082713 2019.11.27
- International Announcement: WO2020/114852A 2020.06.11
- Date entered country: 2021-05-27
- Main IPC: G01D11/24
- IPC: G01D11/24 ; B23K1/19 ; F16L41/00 ; F16L41/08

Abstract:
A sensor arrangement (1) is described comprising a sensor housing (2) and a mounting connector (3). Such a sensor arrangement should be soldered to a refrigeration system without being sensitive for vibrations during operation of the system and without deteriorating a sensor arranged in the housing. To this end the mounting connector (3) is at least partly made of a bi-metal material with an inner layer (10) of steel and an outer layer (11) of copper.
Public/Granted literature
- US20220018475A1 SENSOR ARRANGEMENT Public/Granted day:2022-01-20
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