Invention Grant
- Patent Title: Probe test card and method of manufacturing the same
-
Application No.: US18077775Application Date: 2022-12-08
-
Publication No.: US11933818B2Publication Date: 2024-03-19
- Inventor: Gyung Jin Kim , Jae Hyoung Seo
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: William Park & Associates Ltd.
- Priority: KR 20190173962 2019.12.24
- Main IPC: G01R1/073
- IPC: G01R1/073 ; G01R1/067 ; G01R31/28

Abstract:
A probe test card includes a substrate, a plurality of test needles, and a fixing layer. The substrate includes a first surface at which a trench is formed, and a second surface opposite to the first surface. The plurality of test needles is arranged in the trench. Each test needle includes a first end and a second end being opposite to the first end. The fixing layer is filled in the trench to fix the plurality of test needles in the trench, and a thickness of the fixing layer is same with a depth of the trench. The fixing layer comprises a ceramic powder. The first end of the test needle is non-removably fixed in the trench by the fixing layer and the second end of the test needle protrudes from the trench of the substrate to test a device under test (DUT).
Information query