Invention Grant
- Patent Title: Imprinting method using a solvent to remove a mold and the related imprinting system
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Application No.: US17197255Application Date: 2021-03-10
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Publication No.: US11934097B2Publication Date: 2024-03-19
- Inventor: Sung-Wen Tsai
- Applicant: EVER RADIANT INCORPORATION
- Applicant Address: TW Tainan
- Assignee: EVER RADIANT INCORPORATION
- Current Assignee: EVER RADIANT INCORPORATION
- Current Assignee Address: TW Tainan
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW 8135978 2019.10.04
- Main IPC: B29C33/38
- IPC: B29C33/38 ; B29C59/02 ; G03F7/00

Abstract:
The present invention provides an imprinting method, which includes the steps of: adding a soluble material to a master mold; solidifying the soluble material to form a soluble mold having a mold pattern; adhering a taking device to the soluble mold to separate the soluble mold from the master mold; placing the soluble mold on a polymer layer of a workpiece for imprint; applying a high temperature and a pressure to the soluble mold to allow the polymer layer having an imprint pattern corresponding to the mold pattern and being solidified, and to remove the taking device from the soluble mold; and providing a solvent to dissolve the soluble mold to obtain an imprint workpiece having the imprint pattern.
Public/Granted literature
- US20210200080A1 IMPRINTING METHOD USING A SOLVENT TO REMOVE A MOLD AND THE RELATED IMPRINTING SYSTEM Public/Granted day:2021-07-01
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