Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US17371582Application Date: 2021-07-09
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Publication No.: US11935924B2Publication Date: 2024-03-19
- Inventor: Noh Yeong Park , Dong Il Bae , Beomjin Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20200166512 2020.12.02
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L21/8238 ; H01L27/092 ; H01L29/08 ; H01L29/16 ; H01L29/417 ; H01L29/423

Abstract:
Disclosed are semiconductor devices and/or method of fabricating the same. The semiconductor device comprises a substrate including first and second regions, a first active pattern on the first region and including a pair of first source/drain patterns and a first channel pattern including first semiconductor patterns, a second active pattern on the second region and including a pair of second source/drain patterns and a second channel pattern including second semiconductor patterns, a support pattern between two vertically adjacent first semiconductor patterns, and a first gate electrode and a second gate electrode on the first channel pattern and the second channel pattern. A channel length of the first channel pattern is greater than that of the second channel pattern. A ratio of a width of the support pattern to the channel length of the first channel pattern is in a range of 0.05 to 0.2.
Public/Granted literature
- US20220173214A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-06-02
Information query
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