Invention Grant
- Patent Title: Acrylic resin powder, resin composition, hot melt adhesive composition containing acrylic resin powder and method for producing same
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Application No.: US17031988Application Date: 2020-09-25
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Publication No.: US11939413B2Publication Date: 2024-03-26
- Inventor: Shogo Miyai , Toru Kondo
- Applicant: Mitsubishi Chemical Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Chemical Corporation
- Current Assignee: Mitsubishi Chemical Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 18058236 2018.03.26
- Main IPC: C08F265/06
- IPC: C08F265/06 ; C08F20/14 ; C08G18/62 ; C08J3/12 ; C09J133/12 ; C09J175/06

Abstract:
An acrylic resin powder soluble in acetone, including a multi-stage polymer (M) that includes a polymer (B) obtained by polymerizing a monomer mixture (b) containing methyl methacrylate and an alkyl (meth)acrylate ester (mb) in the presence of a polymer dispersion that contains a polymer (A) obtained by polymerizing a monomer mixture (a) containing an alkyl (meth)acrylate ester (ma), in which an alkyl group in the alkyl (meth)acrylate ester (ma) has 4 to 8 carbon atoms, an alkyl group in the alkyl (meth)acrylate ester (mb) has 4 to 8 carbon atoms, a glass transition temperature of the polymer (A) is 20° C. or lower, a glass transition temperature of the polymer (B) obtained by polymerizing the monomer mixture (b) is 55° C. or higher, and a mass average molecular weight of the multi-stage polymer (M) is 10,000 or more and 300,000 or less.
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