- Patent Title: Polyphenylene ether resin composition, prepreg, metal-clad laminate
-
Application No.: US17632067Application Date: 2020-07-07
-
Publication No.: US11939443B2Publication Date: 2024-03-26
- Inventor: Shota Osumi , Izumi Tando , Hiroki Ueda , Yoshio Hayakawa
- Applicant: NIPPON SODA CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NIPPON SODA CO., LTD.
- Current Assignee: NIPPON SODA CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP 19144191 2019.08.06 JP 20031772 2020.02.27
- International Application: PCT/JP2020/026565 2020.07.07
- International Announcement: WO2021/024679A 2021.02.11
- Date entered country: 2022-02-01
- Main IPC: C08J5/24
- IPC: C08J5/24 ; B32B5/02 ; B32B15/12 ; B32B15/14 ; B32B15/20 ; C08L53/02 ; C08L71/12

Abstract:
A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the component (B) may be 10:90 to 80:20, and the weight average molecular weight (Mw) of the component (B) may be 2,000 to 100,000.
Public/Granted literature
- US20220251376A1 POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE Public/Granted day:2022-08-11
Information query