Invention Grant
- Patent Title: Resin composition for bonding semiconductor and adhesive film for semiconductor using the same
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Application No.: US17404053Application Date: 2021-08-17
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Publication No.: US11939494B2Publication Date: 2024-03-26
- Inventor: Jong Min Jang , Byoung Ju Choi , Kwang Joo Lee , Yu Lin Sun
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: ROTHWELL, FIGG, ERNST & MANBECK, P.C.
- Priority: KR 20200104211 2020.08.19
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C09J133/08
Abstract:
A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.
Public/Granted literature
- US20220098455A1 RESIN COMPOSITION FOR BONDING SEMICONDUCTOR AND ADHESIVE FILM FOR SEMICONDUCTOR USING THE SAME Public/Granted day:2022-03-31
Information query
