Invention Grant
- Patent Title: Film thickness measuring apparatus and film thickness measuring method, and film forming system and film forming method
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Application No.: US17184089Application Date: 2021-02-24
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Publication No.: US11939665B2Publication Date: 2024-03-26
- Inventor: Masato Shinada , Tamaki Takeyama , Kazunaga Ono , Naoyuki Suzuki , Hiroaki Chihaya , Einstein Noel Abarra
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMTED
- Current Assignee: TOKYO ELECTRON LIMTED
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JP 20040854 2020.03.10 JP 20184211 2020.11.04
- Main IPC: C23C14/54
- IPC: C23C14/54 ; G01B11/06 ; G01S7/481 ; G01S17/08 ; H01F41/32 ; H01L21/66 ; H10N50/01

Abstract:
A film thickness measurement apparatus includes: a stage that places a substrate having a film formed thereon and measures a thickness of the film in-situ in a film forming apparatus; a film thickness meter including a light emitter that emits light toward the substrate disposed on the stage and a light receiving sensor that receives the light reflected by the substrate for measuring the thickness of the film in-situ; a moving mechanism including a multi-joint arm that moves an irradiation point of the light on the substrate; a distance meter that measures a distance between the light receiving sensor and the irradiation point on the substrate; and a distance adjustor that adjusts the distance between the light receiving sensor and the irradiation point on the substrate.
Public/Granted literature
Information query
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