Invention Grant
- Patent Title: Pressure sensing device, pressure sensing method and electronic terminal with compact structure and high sensitivity
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Application No.: US17416384Application Date: 2018-12-20
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Publication No.: US11940337B2Publication Date: 2024-03-26
- Inventor: Hao Li , Xuepeng Lin
- Applicant: SHENZHEN NEW DEGREE TECHNOLOGY CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: SHENZHEN NEW DEGREE TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN NEW DEGREE TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: NIXON & VANDERHYE, P.C.
- International Application: PCT/CN2018/122314 2018.12.20
- International Announcement: WO2020/124477A 2020.06.25
- Date entered country: 2021-06-18
- Main IPC: G01L1/18
- IPC: G01L1/18

Abstract:
The pressure sensing device includes a substrate and a pressure sensor. The pressure sensor used is a thin-film piezoresistive sensor with a certain area, and a power wire, a ground wire, and two differential wires are led out from ends of the pressure sensor respectively, and the pressure sensor is arranged on the substrate. The substrate is simply attached to the object being tested that is to be subjected to pressure, the pressure sensor is connected to a pressure sensing detection circuit, the object being tested deforms under pressure, and the thin-film piezoresistive sensor deforms as the substrate deforms. The deformation of the substrate is detected through detecting the voltage drop between the two differential wires, which is converted to obtain the pressure on the object being tested, thereby realizing a pressure-sensitive touch function. A pressure sensing method and an electronic terminal with the pressure sensing device are also provided.
Public/Granted literature
- US20220057277A1 PRESSURE SENSING DEVICE, PRESSURE SENSING METHOD AND ELECTRONIC TERMINAL Public/Granted day:2022-02-24
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