Invention Grant
- Patent Title: Particle measurement device, three-dimensional shape measurement device, prober device, particle measurement system, and particle measurement method
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Application No.: US18459132Application Date: 2023-08-31
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Publication No.: US11940463B2Publication Date: 2024-03-26
- Inventor: Natsumi Hayashi , Hideki Morii , Tetsuo Yoshida , Toshiyuki Kimura
- Applicant: Tokyo Seimitsu Co., Ltd.
- Applicant Address: JP Hachioji
- Assignee: TOKYO SEIMITSU CO., LTD.
- Current Assignee: TOKYO SEIMITSU CO., LTD.
- Current Assignee Address: JP Hachioji
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 21032413 2021.03.02
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R1/073

Abstract:
The particle measurement device includes: an acquiring unit configured to acquire pad surface shape data indicating a surface shape of an electrode pad including a probe needle mark where a probe needle has contacted; a roughness calculating unit configured to calculate volume of a recessed portion recessed from a pad reference surface and volume of a protruding portion protruding from the pad reference surface based on the pad surface shape data; and a particle quantity calculating unit configured to calculate a particle quantity from a volume difference between the volume of the recessed portion and the volume of the protruding portion.
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Information query