Invention Grant
- Patent Title: Interleaved testing of digital and analog subsystems with on-chip testing interface
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Application No.: US17990607Application Date: 2022-11-18
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Publication No.: US11940490B2Publication Date: 2024-03-26
- Inventor: Praveen Raghuraman
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated/Seyfarth Shaw LLP
- The original application number of the division: US16983938 2020.08.03
- Main IPC: G01R31/317
- IPC: G01R31/317 ; G01R31/3167 ; G01R31/3177

Abstract:
The disclosure provides a method and apparatus of interleaved on-chip testing. The method merges a test setup for analog components with a test setup for digital components and then interleaves the execution of the digital components with the analog components. This provides concurrency via a unified mode of operation. The apparatus includes a system-on-chip test access port (SoC TAP) in communication with a memory test access port (MTAP). A built-in self-test (BIST) controller communicates with the MTAP, a physical layer, and a memory. A multiplexer is in communication with the memory and a phase locked loop (PLL) through an AND gate.
Public/Granted literature
- US20230078568A1 INTERLEAVED TESTING OF DIGITAL AND ANALOG SUBSYSTEMS WITH ON-CHIP TESTING INTERFACE Public/Granted day:2023-03-16
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