Invention Grant
- Patent Title: Composite magnetic particle including metal magnetic particle
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Application No.: US18071796Application Date: 2022-11-30
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Publication No.: US11942249B2Publication Date: 2024-03-26
- Inventor: Atsushi Tanada
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Pillsbury Winthrop Shaw Pittman, LLP
- Priority: JP 19062218 2019.03.28
- Main IPC: H01F17/04
- IPC: H01F17/04 ; B22F1/052 ; B22F1/102 ; B22F1/17 ; H01F1/153 ; H01F1/24 ; H01F1/26 ; H01F1/33 ; H01F27/255 ; B22F1/10

Abstract:
A composite magnetic body according to one aspect of the present invention includes a first metal magnetic particle covered with a first resin portion made of a first resin material and a second metal magnetic particle having a smaller particle size than the first metal magnetic particle, where the second metal magnetic particle is bound to the first metal magnetic particle via a second resin portion made of a second resin material, the second resin material having a softening point higher than the first resin material.
Public/Granted literature
- US20230187110A1 COMPOSITE MAGNETIC PARTICLE INCLUDING METAL MAGNETIC PARTICLE Public/Granted day:2023-06-15
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