A package device can include: a package body having a support body and an encapsulating body configured to encapsulate a conductive body of the package device; at least one extraction electrode electrically connected to the conductive body, and having a part exposed outside the package body; and where the support body is located on only part of a bottom surface of the encapsulating body, and protrudes from the bottom surface of the encapsulating body to form a cavity defined by the remaining exposed bottom surface of the encapsulating body and inner side surface of the supporting body.