Invention Grant
- Patent Title: Coil component
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Application No.: US17114987Application Date: 2020-12-08
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Publication No.: US11942264B2Publication Date: 2024-03-26
- Inventor: No Il Park , Byung Soo Kang , Seung Mo Lim , Byeong Cheol Moon , Boum Seock Kim , Yong Hui Li , Seung Min Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200124397 2020.09.25
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F27/32 ; H01F41/04 ; H01F41/12

Abstract:
A coil component includes a body having a first surface, and a first end surface and a second end surface connected to the first surface and opposing each other in a length direction; a support substrate disposed inside the body; a coil portion comprising a first coil pattern and first and second lead-out patterns, each disposed on a first surface of the support substrate; first and second slit portions, respectively defined on edge portions of the first surface of the body to expose the first and second lead-out patterns; and first and second external electrodes disposed on the first and second slit portions to be connected to the first and second lead-out patterns. At least one of the first and second lead-out patterns has a thickness greater than a thickness of each of the first coil pattern and the first dummy lead-out pattern.
Public/Granted literature
- US20220102061A1 COIL COMPONENT Public/Granted day:2022-03-31
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