Invention Grant
- Patent Title: Semiconductor package including an electromagnetic shield and method of fabricating the same
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Application No.: US18194381Application Date: 2023-03-31
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Publication No.: US11942437B2Publication Date: 2024-03-26
- Inventor: Youngwoo Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. CHAU & ASSOCIATES, LLC
- Priority: KR 20190062815 2019.05.28
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L23/552
Abstract:
Disclosed are semiconductor packages and methods of fabricating the same. The method includes forming a semiconductor chip, forming an electromagnetic shield that covers the semiconductor chip, and forming a molding that covers the electromagnetic shield. The electromagnetic shield is electrically connected to a conductor on a side of the semiconductor chip.
Public/Granted literature
- US20230245981A1 SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME Public/Granted day:2023-08-03
Information query
IPC分类:
