Invention Grant
- Patent Title: Electronic component, multiplexer, and module
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Application No.: US17176804Application Date: 2021-02-16
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Publication No.: US11942438B2Publication Date: 2024-03-26
- Inventor: Motoi Yamauchi , Masato Ito
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Stein IP, LLC
- Priority: JP 20045802 2020.03.16
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/02 ; H01L23/31 ; H01L23/498 ; H03H9/05 ; H10N30/88

Abstract:
An electronic component includes a first substrate having a substantially quadrangular planar shape and having a first surface and a second surface, the first surface and the second surface being opposite to each other, an element disposed on the first surface, four first terminals located adjacent to four corners on the second surface, respectively, and a second terminal located between the first terminals at respective ends of each of two sides opposite to each other of the second surface, an area of the second terminal being smaller than an area of each of the first terminals at the respective ends of each of the two sides, a width of the second terminal in an extension direction of each of the two sides being equal to or less than a width of each of the first terminals at the respective ends of each of the two sides in the extension direction.
Public/Granted literature
- US20210288001A1 ELECTRONIC COMPONENT, MULTIPLEXER, AND MODULE Public/Granted day:2021-09-16
Information query
IPC分类: